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[CASE Seminar] 3D Printed Sensor Systems

일자
2017.10.24(화)
시간
16:30
연사
Professor Woo Soo Kim
장소
RIST Research Building 3. #3376 Seminar Room
소속
Mechatronic Systems Engineering, Simon Fraser University
[Abstrat]
2D & 3D printed electronic applications with multi-material variation have been discussed when I visited POSTECH last year. It is great to visit POSTECH once again in this time during my Sabbatical visit in Korea. In this talk, I will discuss recent research activities of 3D printed IoT devices and their manufacturing with various 3D printable conductive materials’ perspective. This talk will also suggest a future platform for a universal 3d printer system that combines methodologies including Fused Deposition Modeling (FDM), Paste Extrusion, and Digital Light Projection (DLP). Specially, 3D printed sensor systems and their integration with Printed Circuit Board (PCB) will be discussed as a next-generation 3D PCB manufacturing technology.